| 星载BX1750A芯片抗单粒子翻转性能评估 |
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| 引用本文： | 杨钧.星载BX1750A芯片抗单粒子翻转性能评估[J].上海航天,2005,22(1):52-56. |
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| 作者姓名： | 杨钧 |
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| 作者单位： | 上海卫星工程研究所,上海,200240 |
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| 摘 要： | 用软件包和FOM方法分别计算了BX1750A芯片在三种太阳同步轨道以及不同宇宙环境下的单粒子翻转率。根据器件及单片机系统在轨单粒子翻转率与“零翻转”可靠度的关系，量化地评估了该芯片及所属系统应用于不同飞行任务时的抗单粒子翻转(SEU)性能。分析结果表明，BX1750A芯片抗单粒子效应的性能较高，可作为低太阳同步轨道3年或5年寿命卫星关键计算机系统的选用芯片。同时为确保系统SEU零失效，有必要采取软件和其他加固措施。
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| 关 键 词： | 单粒子翻转 FOM方法 软件加固 占空比 |
| 文章编号： | 1006-1630(2005)01-0052-05 |
| 修稿时间： | 2004年4月16日 |
Evaluation of the Resistance Capability to Single-Event Upset for On-Board BX1750A Chip |
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| YANG Jun.Evaluation of the Resistance Capability to Single-Event Upset for On-Board BX1750A Chip[J].Aerospace Shanghai,2005,22(1):52-56. |
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| Authors: | YANG Jun |
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| Abstract: | The single-event upset (SEU) rate in three kinds of sun-synchronous orbits (SSO) for the BX1750A chip in three different sun-synchronous orbits was calculated using relevant software and the FOM method respectively in this paper. According to the relationship between SEU rate of device & single chip system and the survival probability of zero upset, the quantitatively evaluation of the resistance capability to SEU for the chip and its system during various flying mission was made. The analysis results showed that BX1750A chip had high ability to resist SEU, which could be used for key computer system in satellite with life cycle of 3 or 5 years. Meanwhile, it was necessary to take hardening measures of software and others for ensuring the zero invalidation of system SEU. |
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| Keywords: | Single-event upset Figure of merit method Software hardening design Duty cycle |
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