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BPFER/DSX体系固化反应动力学与热性能
引用本文:宋秋生,徐蕤,杨洋,荚智超.BPFER/DSX体系固化反应动力学与热性能[J].固体火箭技术,2012,35(2):262-266.
作者姓名:宋秋生  徐蕤  杨洋  荚智超
作者单位:合肥工业大学化工学院,合肥,230009
基金项目:广东省教育部产学研合作项目
摘    要:采用DSC研究了有机硅固化剂1,3-二氨丙基-1,1,3,3-四甲基二硅氧烷(DSX)与双酚F环氧树脂(BPFER)的固化动力学。BPFER/DSX体系的非等温固化反应曲线和dα/dt-t曲线表明,该反应符合自催化反应模型的基本特征。T-β曲线预测的固化工艺的凝胶温度、固化温度和后固化温度分别为36、87、138℃。采用E变量法分析得该体系的固化反应表观活化能为46.70~50.54 kJ/mol,与Starink、Kissinger、Ozawa、Boswell等方程的验证结果基本一致。采用E常量法求得该体系不同升温速率下的固化反应动力学方程,动力学方程预测值与实验值十分吻合。TG和DTG曲线表明,BPFER/DSX固化物的耐热性优于BPFER/DDM固化物。

关 键 词:有机硅固化剂  固化反应动力学  E变量法  E常量法  耐热性

Curing kinetics and thermal properties of BPFER/DSX system
SONG Qiu-sheng , XU Rui , YANG Yang , JIA Zhi-chao.Curing kinetics and thermal properties of BPFER/DSX system[J].Journal of Solid Rocket Technology,2012,35(2):262-266.
Authors:SONG Qiu-sheng  XU Rui  YANG Yang  JIA Zhi-chao
Institution:(School of Chemical Engineering,Hefei University of Technology,Hefei 230009,China)
Abstract:The kinetics of curing reaction for a system of 1,3-Bis(γ-aminopropyl)tetramethyldisiloxane(DSX)/diglycidyl ether bisphenol F(BPFER) was studied by differential scanning calorimetry(DSC).DSC curves and dα/dt-t curves suggest that the curing reaction of BPFER/DSX system is a kind of autocatalytic reaction.According to the T-β curves,the characteristic temperatures such as gelation temperature(Tgel),curing temperature(Tcure) and postcuring temperature(Tpostcure) were 36 ℃,87 ℃ and 138 ℃ respectively.The apparent activation energy(Ea) was 46.70~50.54 kJ/mol by E variable method,which was very close to the results from the equations of Starink,Kissinger,Ozawa,Boswell.The kinetics equations at different heating rate were obtained by E constants method.The predicted results agree well with the experimental data.The TG and DTG curves indicat that heat resistance of cured BPFER/DSX is superior to that of BPFER/DDM.
Keywords:organic silicon curing agent  curing reaction kinetics  E variable method  E constants method  heat-resistance
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