| Ni/Ti中间层部分瞬间液相法连接C/C复合材料和GH3044 |
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| 引用本文： | 张书美,李克智,王杰,宋忻睿,郭领军.Ni/Ti中间层部分瞬间液相法连接C/C复合材料和GH3044[J].固体火箭技术,2012,35(3):414-418. |
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| 作者姓名： | 张书美 李克智 王杰 宋忻睿 郭领军 |
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| 作者单位： | 西北工业大学炭/炭复合材料工程技术研究中心,西安,710072 |
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| 基金项目： | 自然科学基金，航天支撑技术基金 |
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| 摘 要： | 采用Ni/Ti中间层,部分瞬间液相法(Partial Transient Liquid-Phase,简称PTLP)连接C/C复合材料和GH3044,通过SEM+EDS对接头的微观结构和元素分布进行了表征,并分析了接头形成机理。研究表明,这种方法可实现C/C复合材料与中间层、中间层与GH3044界面处的良好结合;所得接头截面为GH3044/扩散层/残余Ni层/Ni-Ti金属间化合物层/炭化物反应层/C/C复合材料;随保温时间的延长,接头中金属间化合物Ni3Ti不断生长,同时两侧的Ni、NiTi被逐渐消耗。另外,因为C/C复合材料和GH3044的热膨胀系数(Coefficient of Thermal Expansion,CTE)差别很大,所以冷却过程中产生了较大的热应力,导致C/C复合材料/中间层界面附近出现了大尺寸裂纹,使接头性能下降,其剪切强度仅有9.78 MPa。
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| 关 键 词： | 部分瞬间液相(PTLP)连接 C/C复合材料 GH3044 形成机理 热应力 |
PTLP bonding C/C composites to super-alloy GH3044with Ni/Ti interlayer |
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| ZHANG Shu-mei
,
LI Ke-zhi
,
WANG Jie
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SONG Xin-mi
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GUO Ling-jun.PTLP bonding C/C composites to super-alloy GH3044with Ni/Ti interlayer[J].Journal of Solid Rocket Technology,2012,35(3):414-418. |
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| Authors: | ZHANG Shu-mei LI Ke-zhi WANG Jie SONG Xin-mi GUO Ling-jun |
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| Institution: | (C/C Composites Technology Research Center,Northwestern Polytechnical University,Xi’an 710072,China) |
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| Abstract: | C/C composites can be jointed to super-alloy GH3044 with Ni/Ti interlayer by partial transient liquid-phase(PTLP) bonding under vacuum.Microstructures and element distribution were characterized by SEM and EDS.Interfacial structure of Ni/GH3044 diffusion layer + residual Ni layer + Ni-Ti intermetalics + reaction layer was formed under experimental conditions.With the increase of holding time,Ni3Ti intermetalic layer between NiTi and Ni gradually grew,while NiTi and Ni were consumed.However,large-size cracks were observed near the C/C composite/interlyer interface,resulting in unsatisfactory performance of obtained joints,with the shear strength of only 9.78 MPa. |
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| Keywords: | PTLP bonding C/C composites GH3044 formation mechanism thermal stress |
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