| 基于激光旋切法的陶瓷材料盲孔加工方法研究 |
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| 引用本文： | 郑亮,李良,张华,黄红耀.基于激光旋切法的陶瓷材料盲孔加工方法研究[J].火箭推进,2013,39(4):62-66. |
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| 作者姓名： | 郑亮 李良 张华 黄红耀 |
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| 作者单位： | 西安航天发动机厂,陕西西安,710100 |
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| 摘 要： | 介绍了激光打孔的基本原理,对激光能量、离焦量、轨迹在激光旋切法加工盲孔过程中对孔形和表面质量的影响进行了分析和试验验证,并给出了一般规律.依据试验结果确定了合理工艺参数,采用旋切法在碳纤维增强碳化硅陶瓷基复合材料（Cf/SiC）上打出了孔径为1 mm,孔深为1.1 mm,锥度小于15°的盲孔.
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| 关 键 词： | 激光打孔 旋切法 碳化硅陶瓷 盲孔 |
Study on ceramic blind hole processing method based on laser rotation cutting |
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| ZHENG Liang
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LI Liang
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ZHANG Hua
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HUANG Hong-yao.Study on ceramic blind hole processing method based on laser rotation cutting[J].Journal of Rocket Propulsion,2013,39(4):62-66. |
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| Authors: | ZHENG Liang LI Liang ZHANG Hua HUANG Hong-yao |
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| Institution: | (Xi＇ an Space Engine Factory, Xi＇an 710100, China) |
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| Abstract: | The basic principle of laser drilling is introduced in this paper. The influence of laser energy, defocusing amount and trajectory during the ceramic blind hole processing on hole shape and surface quality was analyzed and verified in experiments. A general law is given. The rational process parameters were determined according to the test results. The rotation cutting was adopted to make the blind hole on Cf/SiC, whose diameter is 1 mm, depth is 1.1 mm and taper is less than 15°. |
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| Keywords: | laser drilling rotation cutting silicon carbide ceramic blind hole |
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