| 微电子封装技术及发展趋势综述 |
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| 引用本文： | 关晓丹,梁万雷.微电子封装技术及发展趋势综述[J].北华航天工业学院学报,2013,23(1):34-37. |
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| 作者姓名： | 关晓丹 梁万雷 |
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| 作者单位： | 北华航天工业学院电子工程系,河北廊坊,065000 |
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| 基金项目： | 河北省青年基金项目(Q2012149) |
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| 摘 要： | 随着电子产品小型化、高集成度的发展趋势,电子产品的封装技术正逐步迈入微电子封装时代。本文对微电子封装的关键技术进行了介绍,介绍了芯片互连工艺、典型封装技术和MCM技术。同时,本文对微电子封装技术的发展趋势及应用前景进行了综述。
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| 关 键 词： | 微电子封装 芯片互连技术 MCM 发展趋势 |
An Overview of Microelectronic Packaging Technology and its Development Trend |
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| GUAN Xiao-dan
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LIANG Wan-lei.An Overview of Microelectronic Packaging Technology and its Development Trend[J].Journal of North China Institute of Aerospace Engineering,2013,23(1):34-37. |
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| Authors: | GUAN Xiao-dan LIANG Wan-lei |
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| Institution: | (Electronic Engineering Department,North China Institute of Aerospace Engineering,Langfang 065000,China) |
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| Abstract: | With the development trend of the miniaturization and high integration degree of electronic products, the packaging technol-ogy is gradually experiencing a microelectronic era. This article introduces the key technologies of microelectronics packaging such as the chips interconnect technology, typical packaging and MCM. It also reviews the development trends and application prospects of microelectronics packaging technology. |
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| Keywords: | microelectronic packaging chip interconnect technology MC M development trends |
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