| Abstract: | Lightweight epoxy resin potting materials are widely used in machinery, electronics, aerospace and other fields. The delamination of different density fillers in lightweight epoxy resin potting materials during curing will reduce the uniformity of epoxy resin potting materials and produce stress concentration, which will affect the properties of potting materials, In this paper, hollow glass beads were added to the system as lightweight fillers. Different homogeneous lifting schemes were designed, such as coupling treatment, low temperature gel technology and small particle size boron nitride. The effects of different process conditions on the density and uniformity of epoxy resin potting material system were studied. The results showed that the coupling treatment had little effect on the uniformity and could not effectively inhibit the delamination of the system; low temperature gel technology and small particle size BN filler can reduce the density difference of epoxy material system to 0.069g/cm3 and 0.015g/cm3 respectively, and significantly enhance the uniformity of epoxy resin encapsulating material. |
