光学材料磨削加工亚表面损伤层深度测量及预测方法研究

针对光学材料磨削加工引入的亚表面损伤层,综合使用磁流变抛光斑点技术和HF差动化学蚀刻速率法测量亚表面裂纹层深度和亚表面残余应力层厚度。建立了亚表面裂纹层深度与表面粗糙度间关系的理论模型,以实现亚表面裂纹层深度的准确预测,并通过分析亚表面裂纹尖端应力场,预测了亚表面裂纹尖端塑性层厚度。

Research on Measurement and Prediction Methods of Subsurface Damage Depth of Optical Materials in Grinding Process

For the subsurface damage layer of optical materials in grinding process, a combined method of MRF spot technique and HF acid differential chemical etch rate method was proposed to measure the depth of subsurface crack layer and thickness of residual stress layer. For the purpose of accurate prediction of subsurface crack depth, a theoretical model of relationship between subsurface damage and surface roughness was established. Finally, the thickness of the plastic stress layer was predicted through analyzing the stress field in crack tip.