温度交变环境下防热结构胶层厚度设计

再入返回式航天器飞行过程中,在轨温度交变环境下防热结构胶接热应力一直是航天器可靠性设计的关注內容恼乱浴爸忻芏确廊炔牧?硅橡胶-金属"的胶接结构作为对象,针对典型的低地球轨道温度交变环境,选取±100℃/5个循环环境作为分析条件,用ANSYSWorkbench建立了结构有限元分析模型,考察了不同胶层厚度对于结构热应力及热变形的影响。基于有限元计算结果、热应力理论及胶接工艺分析,给出了温度交变环境下防热结构的胶层厚度设计结果.该有限元模型分析方法可为防热结构热匹配特性研究和设计提供基础依据。

Design of bond-layer thickess of thermal protection gbllcture under altemating temperature condition

The thermal stress in a thermal protection structure （TPS） in the reentry spacecraft under the alternating in-orbit temperature condition during flight is always an important issue. This paper investigates the bonded structure of ＂mid-density shield -silicon -metal＂ under ±100 ℃/5 cycles based on the typical thermal condition of the low-earth-orbit. Influences of the bond-layer thickness on the thermal stress and deformation are obtained by the finite element analysis （FEA） model based on ANSYS software. The optimal TPS bond-layer thickness is obtained for the application in the present thermal condition according to the analysis of the FEA results, the thermal stress theory, and the bond processing. The FEA simulation results can be used for TPS thermal-match property study and design.