| 电子封装用金属基复合材料的研究现状 |
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| 引用本文： | 周贤良,吴江晖,张建云,华小珍,周云军.电子封装用金属基复合材料的研究现状[J].南昌航空工业学院学报,2001,15(1):11-15. |
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| 作者姓名： | 周贤良 吴江晖 张建云 华小珍 周云军 |
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| 作者单位： | 南昌航空工业学院材料科学与工程系!江西南昌330034 |
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| 摘 要： | 本文介绍了电子封装用金属基复合材料的研究现状 ,分别从基体、增强体、制备工艺几方面讨论了其对复合材料性能的影响 ,着重介绍了作为电子封装材料应用前景较好的高比例SiC颗粒增强铝基复合材料及其已部分实现规模工业化生产的铸造法。并进一步提出了尚待解决的问题
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| 关 键 词： | 电子封装 金属基合材料 热性能 |
| 文章编号： | 1001-4920(2001)01-0011-05 |
| 修稿时间： | 2000年11月30 |
A Review of Metal-Martix Composites for Electronic Packaging |
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| Zhou Xianliang,Wu Jianhui,Zhang Jianyun,Hua Xiaozhen,Zhou Yunjun.A Review of Metal-Martix Composites for Electronic Packaging[J].Journal of Nanchang Institute of Aeronautical Technology(Natural Science Edition),2001,15(1):11-15. |
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| Authors: | Zhou Xianliang Wu Jianhui Zhang Jianyun Hua Xiaozhen Zhou Yunjun |
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| Abstract: | In this paper,a review of Metal Matrix Composites(MMCs)for electronic packaging is presented,and various factors which influence the thermal properties of materials including matrix,reinforcement,processing method are discussed.Al-matrix composites with SiC particle reinforcements,which have good prospect of application,is emphatically introduced.Then,some problems that need further investigation are presented. |
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| Keywords: | Electronic packaging Metall matrix composite Thermal properties |
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