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高体积分数SiCp/Al的化学镀镍
引用本文:张建云%吴鹏%周贤良%华小珍.高体积分数SiCp/Al的化学镀镍[J].宇航材料工艺,2007,37(3):43-45.
作者姓名:张建云%吴鹏%周贤良%华小珍
作者单位:南昌航空工业学院材料工程系,南昌,330034
摘    要:在进行无钯活化预处理后,对高体积分数SiCp/Al进行化学镀镍,研究了温度和pH值对镀层和沉积速度的影响。采用SEM观察镀层形貌,通过EDX测定镀层的镍磷含量,并用XRD分析了镀层的显微结构。结果表明:在特殊预处理后,采用化学镀镍,可在高体积分数SiCp/Al表面沉积上致密、均匀、结合牢固的镍镀层,镀层为微晶结构,属于中磷镀层。

关 键 词:SiCp/Al复合材料  预处理  化学镀镍  显微结构
修稿时间:2006-07-26

Electroless Nickel Plating on High Volume Fraction SiCp/Al
Zhang Jianyun,Wu Peng,Zhou Xianliang,Hua Xiaozhen.Electroless Nickel Plating on High Volume Fraction SiCp/Al[J].Aerospace Materials & Technology,2007,37(3):43-45.
Authors:Zhang Jianyun  Wu Peng  Zhou Xianliang  Hua Xiaozhen
Institution:Department of Material Engineering, Nanehang Institute of Aeronautical Technology, Nanehang 330034
Abstract:The high volume fraction SiCp/Al is processed by electroless nickel plating after activation without palladium.The influences of temperature and pH on plating rate and plating conditions are studied.The coating morphology is observed by SEM. The contents of nickel and phosphorus on the coating are measured by EDX.The microstructure of coating is analyzed by XRD. The results show that a compacting,uniform and tight bonded Ni-P coating is formed on the surface of SiCp/Al by electroless nickel plating after special pretreatment.The microstructure of the coating is microcrystal,belonging to medium phosphorous coating.
Keywords:SiC_p/Al composite  Pretreatment  Electroless nickel plating  Microstructure
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