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磁流变抛光KDP去除机理实验研究
引用本文:焦飞飞,彭小强,陈浩锋,石峰,铁贵鹏.磁流变抛光KDP去除机理实验研究[J].航空精密制造技术,2012(1):1-4,22.
作者姓名:焦飞飞  彭小强  陈浩锋  石峰  铁贵鹏
作者单位:国防科学技术大学机电工程与自动化学院
摘    要:针对KDP晶体质地软、脆性高、易潮解等不利于加工的材料特性,提出了基于潮解原理的无磨料非水基磁流变抛光新工艺,获得了表面粗糙度PV=13.7nm,Rms=1.1nm的超光滑表面。通过分析得出新型磁流变抛光通过溶解作用完成材料去除;实验证明新型液体抛光过程中,溶解作用占主导地位,机械去除作用很小,可忽略不计;去除效率随抛光区域剪切应力增大而增大,而正压力分布对去除效率没有影响。

关 键 词:KDP  磁流变抛光  无磨料抛光  去除机理

Research on Removal Mechanism of Magnetorheological Polishing of KDP Crystal
Institution:JIAO Fei-fei,PENG Xiao-qiang,CHEN Hao-feng,et al.(College of Mechatronics Engineering and Automation,National University of Defense Technology,Changsha 410073)
Abstract:Considering the material characteristics of potassium dihydrogen phosphate(KDP) of low hardness,high brittleness and easy deliquescence was proposed.Surface roughness reached PV=13.7nm,Rms=1.1nm.Removal mechanism was deduced to be the result of dissolution reaction via analyzing and comparing both traditional and novel MRF material removal process.The experiments were carried out and testified the dominant role of dissolution reaction in material removal whereas mechanical removal can be ignored;material removal efficiency had a positive relation with shear stress,and had no correlation with orthogonal pressure.
Keywords:potassium dihydrogen phosphate  magnetorheological figuring  abrasive-free  polishing  removal mechanism
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