苯并恶嗪树脂基的Z-pin拉挤工艺(英文)

Z-pin技术是一种有效的复合材料层间增强方法,本文对苯并恶嗪树脂的Z-pin拉挤工艺进行了深入研究。以差热扫描量热仪(Differentialscanningcalorimeter,DSC)分析苯并恶嗪固化特性为基础,结合外观检查和Z-pin短梁剪切试验研究得到合适的拉挤模具温度。设计了Z-pin拔脱试验并利用该试验研究了后烘道温度对Z-pin与层合板结合强度的影响,获得了后烘道的最优温度。最后分析了Z-pi的显微照片并对Z-pin质量进行整体评价。结果表明,苯并恶嗪树脂加热至70°C时,其粘度可满足拉挤需要,工艺适用期约为4h;随着模具温度的升高至140°C,Z-pin的短梁剪切强度逐渐提高,并且截面形状圆度更佳;随着后烘道温度降低,Z-pin与层合板的结合强度提高,但当温度低于200°C时,Z-pin内部出现了气泡,后烘道温度的最佳温度为200°C。

PULTRUSION OF POLYBENZOXAZINE RESIN MATRIX Z-PIN

The pultrusion of the polybenzoxazine resin matrix Z-pin is studied, because the Z-pin technology is an efficient reinforcement method for composites. Based on the curing characteristics acquired by differential scanning calorimeter(DSC) analysis, the suitable mould temperature for pultrusion is researched with the visual inspection and the Z-pin short beam shear test. The pull-out test is designed to evaluate the post oven temperature that can affect the combination between Z-pins and laminates. And then, the appropriate temperature for the post oven is obtained. Finally, micro photos are used to inspect the defects in Z-pins. The results show that when the resin is heated to 70°C, Z-pin pultrusion demands for viscosity are satisfied, and the shelf-life is about 4 h. With the mould temperature increasing to 140°C, the Z-pin short beam shear strength rises correspondingly and the cross section profile is the best. When the post oven temperature declines, the combination between Z-pins and laminates becomes stronger. However, pores appear in Z-pins unless the oven temperature increases to 200°C. Therefore, the optimum post oven temperature should be set at 200°C.