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| 从有铅向无铅焊接过渡阶段应注意的问题 | |
| 引用本文： | 顾霭云 赵东明 曹白杨. 从有铅向无铅焊接过渡阶段应注意的问题[J]. 华北航天工业学院学报, 2005, 15(3): 1-5,9 |
| 作者姓名： | 顾霭云 赵东明 曹白杨 |
| 作者单位： | [1]公安部第一研究所,北京100000 [2]廊坊师范学院,河北廊坊065000 [3]北华航天工业学院电子工程系,河北廊坊065000 |
| 摘 要： | 目前正处于从有铅向无铅焊接过渡的特殊阶段，无铅材料、印制板、元器件、检测、可靠性等方面都没有标准，无铅工艺方面在国内处于比较混乱的阶段。本文较全面地分析了无铅焊接的现状、无铅焊接的特点和对策、无铅焊接存在的主要问题，以及过渡阶段有铅、无铅混用应注意的问题。 |
| 关 键 词： | 无铅焊接 无铅元器件 无铅印制板 无铅可靠性 |
| 文章编号： | 1009-2145（2005）03-0001-05 |
| 收稿时间： | 2005-06-01 |
| 修稿时间： | 2005-06-01 |
Application and Development of Surface Mount Technology |
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| Gu AiYun;Zhao DongMing;Cao BaiYang. Application and Development of Surface Mount Technology[J]. Journal of North China Institute of Astronautic Engineering, 2005, 15(3): 1-5,9 | |
| Authors: | Gu AiYun Zhao DongMing Cao BaiYang |
| Abstract: | It is in the special stage to transfer from lead solder to lead-free solder. The things such as lead-free material, PCB,component,examination and reliability have no common standard. In this paper, the actuality of lead-free solder and its characteristics and countermeasures are introduced in detail, otherwise, the main problems of lead-free solder and the problems when lead solder and leadfree solder were used together that should be paid attention to during the transfer stage are also analyzed entirely. |
| Keywords: | lead-free solder lead-free component lead-free PCB lead-free reliability |
| 本文献已被 CNKI 维普 等数据库收录！ | |