| 用Ti/Cu/Ni中间层二次部分瞬间液相连接Si3N4陶瓷的研究 |
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| 引用本文： | 邹家生,蒋志国,初亚杰,陈铮. 用Ti/Cu/Ni中间层二次部分瞬间液相连接Si3N4陶瓷的研究[J]. 航空材料学报, 2005, 25(5): 29-33 |
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| 作者姓名： | 邹家生 蒋志国 初亚杰 陈铮 |
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| 作者单位： | 南京理工大学,材料科学与工程系,南京,210094;江苏科技大学,材料学院,江苏,镇江,212003;江苏科技大学,材料学院,江苏,镇江,212003 |
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| 基金项目： | 江苏省自然科学基金项目(BK2003045)江苏省高校自然科学基金项目(03KJB430006) |
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| 摘 要： | 采用Ti/Cu/Ni中间层对Si3N4陶瓷进行二次PTLP连接,研究Ti箔厚度、连接工艺参数对Si3N4/Ti/C/Ni连接强度和界面结构的影响.结果表明Ti箔厚度对连接强度的影响是通过对反应层厚度的影响体现的;在本文试验条件下,改变二次连接工艺参数对Si3N4/Ti/Cu/Ni二次PTLP连接界面反应层厚度无明显影响,其对室温强度的影响是由于连接接头残余应力的变化所导致的;Si3N4/Ti/Cu/Ni二次PTLP连接界面微观结构为Si3N4/反应层/Cu-Ni固溶体层(少量的Cu-Ni-Ti)/Ni.
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| 关 键 词： | 氮化硅 二次PTLP连接 连接强度 界面结构 反应层 |
| 文章编号： | 1005-5053(2005)05-0029-05 |
| 修稿时间： | 2004-02-17 |
Study on Double Partial Transient Liquid Phase Bonding with Si3N4 Ceramic Using Ti/Cu/Ni Interlayer |
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| ZOU Jia-sheng,JIANG Zhi-guo,CHU Ya-jie,CHEN Zheng. Study on Double Partial Transient Liquid Phase Bonding with Si3N4 Ceramic Using Ti/Cu/Ni Interlayer[J]. Journal of Aeronautical Materials, 2005, 25(5): 29-33 |
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| Authors: | ZOU Jia-sheng JIANG Zhi-guo CHU Ya-jie CHEN Zheng |
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| Affiliation: | ZOU Jia-sheng~ |
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| Abstract: | The influence of Ti foil and bonding technical parameters on bonding strength and interface structure was studied under double PTLP bonding with Si_3N_4 ceramic using Ti/Cu/Ni interlayer.The results showed that influence of Ti foil thickness on bonding strength was embodied by thickness of reaction layer.Under our experiments conditions,double PTLP bonding technical parameters have no influence on thickness of reaction layer in Si_3N_4/Ti/Cu/Ni interface,but influence on bonding strength by changing of residual stress in joint.Microstructure of double PTLP bonding Si_3N_4/Ti/Cu/Ni interface is Si_3N_4/ reaction layer / Cu-Ni solid solution(a small quantity of Cu-Ni-Ti)/Ni. |
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| Keywords: | silicon nitride double PTLP bonding bonding strength interfacial structure reaction later |
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