| 无引线镀金表面贴装器件搪锡技术 |
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| 引用本文： | 王继林,白磊,李珍珍,姚俊华.无引线镀金表面贴装器件搪锡技术[J].航天制造技术,2011(5). |
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| 作者姓名： | 王继林 白磊 李珍珍 姚俊华 |
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| 作者单位： | 北京航天时代光电科技有限公司; |
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| 摘 要： | 针对无引线镀金表面贴装器件(如CLCC等封装类型器件)的手工智能焊台搪锡技术、手工锡锅搪锡技术、返修工作站搪锡技术进行了介绍和讨论,并比较了三种搪锡技术的性能特点,给出了适合无引线镀金表面贴装器件搪锡的最佳方案。
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| 关 键 词： | 无引线镀金表面贴装器件 搪锡技术 |
Tin-lining Technology for Gold-plated Lead-free Surface Mount Devices |
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| Wang Jilin Bai Lei Li Zhenzhen Yao Junhua.Tin-lining Technology for Gold-plated Lead-free Surface Mount Devices[J].Aerospace Manufacturing Technology,2011(5). |
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| Authors: | Wang Jilin Bai Lei Li Zhenzhen Yao Junhua |
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| Institution: | Wang Jilin Bai Lei Li Zhenzhen Yao Junhua(Beijing Aerospace Times Optical-electronic Technology Co.,Ltd.,Beijing 100094) |
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| Abstract: | This paper introduces and discusses the Tin-lining technologies such as handcraft intelligent soldering station technology,handcraft tin pot technology and rework station technology for gold-plated lead-free surface mount devices(for example CLCC devices).The best proposal for Tin-lining of gold-plated lead-free surface mount devices is put forward by comparing the features of these three Tin-lining technologies. |
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| Keywords: | gold-plated lead-free surface mount devices Tin-lining technology |
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