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厚板多层多道焊的数值模拟分析
引用本文:李慧娟%黄振华%张京焘.厚板多层多道焊的数值模拟分析[J].宇航材料工艺,2007,37(5):30-33.
作者姓名:李慧娟%黄振华%张京焘
作者单位:1. 中国航空综合技术研究所,北京,100028
2. 辽河石油勘探局锦州工程技术处,锦州,121209
摘    要:在建立厚板多层多道焊的三维有限元数值分析模型的基础上,利用ANSYS软件中的单元“生死”技术处理多层多道焊问题,模拟得到了厚板多层多道焊时的温度场分布规律,并利用红外热像仪实时测定了实际焊接过程的温度场。比较实测温度场和模拟温度场的结果表明,模拟结果与试验结果基本吻合,证明所建数值模型是正确的。

关 键 词:数值模拟  多层多道焊  温度场  热像仪
修稿时间:2007-06-14

Numerical Simulation of Multi-Layer Welding of Thick Plates
Li Huijuan,Huang Zhenhua,Zhang Jingtao.Numerical Simulation of Multi-Layer Welding of Thick Plates[J].Aerospace Materials & Technology,2007,37(5):30-33.
Authors:Li Huijuan  Huang Zhenhua  Zhang Jingtao
Institution:1 China Aero-Polytechnology Establishment, Beijing 100028; 2. Liaohe Petroleum Exploration Bureau Petrochina, Jinzhou 121209
Abstract:Three dimensional finite element numerical model for multi-layer welding of thick plates is built. The technique of death-birth element in ANSYS is employed to simulate the process of multi-layer welding, and the simulated temperature field distribution is obtained. The practical temperature field is measured real-tlmely by using the thermal infrared imager. A comparison of the simulated temperature field with that of the measured indicates that the simulated results agree in general with those of the experiment, and the numerical model built is correct.
Keywords:Numerical simulation  Multi-Layer weld  Temperature field  Thermal infrared imager
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