连接压力在Ti/Ni/Ti复合层TLP扩散连接Si3N4陶瓷中的作用机制

研究了Ｔｉ／Ｎｉ／Ｔｉ复合层ＴＬＰ扩散连接Ｓｉ３Ｎ４陶瓷时压力对接头形成的作用机制。结果表明，ＴＬＰ来不及与陶瓷发生充分反应并形成高强度结合界面就已完全凝固，为形成高强度的结合界面，必须进一步发生固态扩散反应。只有当连接过程中施加足够的压力，才能保证ＴＬＰ在其存在期间充分铺展陶瓷，并在ＴＬＰ完全凝固后形成大量扩散通道，为固态扩散反应提供必要条件。

Mechanism of Pressure Effect on TLP Bonding of Si3N4 Ceramics with Ti/Ni/Ti Multi-Interlayers

The mechanism of pressure effect on TLP bonding of Si 3N 4 ceramics with Ti/Ni/Ti multi interlayers was investigated.TLP has solidified before full reaction,which could produce strong interface between TLP and Si 3N 4 ceramics completed. The further solid state diffusion reaction is needed to form strong interface. Appropriate pressure should be imposed on the bonding couples so that a large amount of diffusion channels, which are necessary conditions for further solid state reaction, could be formed during TLP's existing.