电子设备冷却用液体冷板表面温度场的一种工程算法 |
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引用本文: | 刘道锦,郭宪民.电子设备冷却用液体冷板表面温度场的一种工程算法[J].直升机技术,2002(2):32-35. |
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作者姓名: | 刘道锦 郭宪民 |
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作者单位: | 1. 中国直升机设计研究所,景德镇,333001 2. 南京航空航天大学宇航学院,南京,210016 |
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摘 要: | 本文提出折合厚度概念,把冷板简化成一个带内热源、导热系统各异的三维稳态导热模型实体,根据能量平衡方程,建立一组适于工程应用的三维非均匀热流冷板数学模型,进行数值求解,计算结果与试验结果比较表明本文数学模型和计算方法是可行的。
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关 键 词: | 冷板 电子设备 传热分析 冷却系统 |
AN ENGINEERING NUMERICAL METHOD ON TEMPERATURE PROFILE OF THE COLD PLATE USED TO ELECTRONIC EQUIPMENT COOLING |
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Authors: | LIU Dao-jin GUO Xian-min |
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Abstract: | Based on the conception of equivalent thickness. Cold-Plale was simplified to be a rectangular body with anisotropic thermal conductivity in this paper. According to the steady energy equivalent equation,a set of mathematical models of tree-dimensional non-uniform heat flow is put forward and verified by experiments in this paper,which is applicable in engineering. |
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Keywords: | cold plate electronic equipment heat transfer analytical cooling eyslems |
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