| SiP陶瓷芯片水汽含量控制工艺方法研究 |
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| 作者姓名： | 蒋尚 刘鸿瑾 刘 群 付宝玲 |
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| 作者单位： | 北京轩宇空间科技有限公司,北京轩宇空间科技有限公司,北京轩宇空间科技有限公司,北京轩宇空间科技有限公司 |
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| 摘 要： | 结合宇航级陶瓷封装芯片的特点和水汽控制要求,对SiP陶瓷封装工艺进行了研究,分析了陶瓷封装过程中产生水汽的各个因素,优化了封装生产工艺流程,增加了预烘转运过程下厂监制,保证了转运时间的工艺过程管控,通过试验验证了管控措施的有效性。
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| 关 键 词： | SiP陶瓷封装 下厂监制 过程管控 |
| 收稿时间： | 2021/5/20 0:00:00 |
| 修稿时间： | 2021/9/5 0:00:00 |
Analysis and control of excessive water vapor in SiP ceramic chip |
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| Authors: | JIANG Shang LIU Hongjin LIU Qun and FU Baoling |
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| Institution: | Beijing SunWise Space Telemetry Ltd,Beijing SunWise Space Telemetry Ltd,Beijing SunWise Space Telemetry Ltd,Beijing SunWise Space Telemetry Ltd |
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| Abstract: | In this paper, combined with the characteristics of aerospace ceramic packaging chip and water vapor control requirements, the SiP ceramic packaging process has been studied. The factors of water vapor in the ceramic packaging process have been analyzed, the packaging production process has been optimized, the factory supervision during the pre drying and transfer process has been added, and the process control of the transfer time has been ensured. The effectiveness of the control measures has been verified through experiments. |
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| Keywords: | SiP ceramic package Water vapor Factory supervision Process control |
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