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低频扭转振动攻丝促进排屑的机理研究
引用本文:韩凤起,张德远.低频扭转振动攻丝促进排屑的机理研究[J].航空精密制造技术,2008,44(2):13-15.
作者姓名:韩凤起  张德远
作者单位:北京航空航天大学机械工程及自动化学院,北京,100083
摘    要:连续攻丝过程中的切屑堵塞造成攻丝扭矩增大和波动,很容易导致丝锥折断。本文分析了低频扭转振动攻丝促进排屑的机理,并通过实验分析了工艺参数对断屑效果的影响,证明回退量是影响切屑长短的主要因素。

关 键 词:低频扭转振动攻丝  切屑堵塞  断屑
文章编号:1003-5451(2008)02-0013-03
修稿时间:2007年10月26

Study on the Mechanism of Chip Remomal of Low-frequency Torsional Vibration Tapping
HAN Feng-qi,ZHANG De-yuan.Study on the Mechanism of Chip Remomal of Low-frequency Torsional Vibration Tapping[J].Aviation Precision Manufacturing Technology,2008,44(2):13-15.
Authors:HAN Feng-qi  ZHANG De-yuan
Abstract:The tap is prone to be broken off because of the increase and undulation tapping torque caused by the blocking of chips. The mechanism of chip removal of low-frequency torsional vibration tap was analyzed. And the effect of machining parameters on the chip breaking was studied by experiments. It is indicated that the reverse rotation angle of tap is the main factor that influences the size of chips.
Keywords:low-frequency vibration tapping  blocking of chips  chip breaking
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