首页 | 本学科首页   官方微博 | 高级检索  
     检索      

正交铺设陶瓷基复合材料基体裂纹演化研究(英文)
引用本文:杨福树,孙志刚,李龙彪,宋迎东.正交铺设陶瓷基复合材料基体裂纹演化研究(英文)[J].南京航空航天大学学报(英文版),2011,28(1):112-119.
作者姓名:杨福树  孙志刚  李龙彪  宋迎东
作者单位:南京航空航天大学能源与动力学院,南京,210016,中国
基金项目:江苏省普通高校 研究生创新基金,南京航空航天大学博士学位论文创新与创优基金
摘    要:采用能量平衡法对正交铺设陶瓷基复合材料在单轴拉伸载荷作用下的基体裂纹演化进行了研究。在拉伸载荷的作用下,正交铺设陶瓷基复合材料有5种开裂模式。开裂模式3包括横向开裂、基体开裂和纤维/基体界面脱粘;开裂模式5只包括基体开裂和纤维/基体界面脱粘。本文得到了两条横向裂纹之间出现开裂模式3和5的初始基体开裂应力;并得到了开裂模式3多裂纹演化的初始基体开裂应力。讨论了铺层厚度、纤维体积含量、纤维/基体界面剪应力和界面脱粘能对基体开裂应力和基体裂纹演化的影响。结果表明,对于SiC/CAS材料而言,两条横向裂纹之间首先出现开裂模式3。

关 键 词:陶瓷基复合材料  正交铺设  基体裂纹演化  能量平衡法

RESEARCH ON MATRIX CRACK EVOLUTION OF CROSS-PLY CERAMIC MATRIX COMPOSITE
Yang Fushu,Sun Zhigang,Li Longbiao,Song Yingdong.RESEARCH ON MATRIX CRACK EVOLUTION OF CROSS-PLY CERAMIC MATRIX COMPOSITE[J].Transactions of Nanjing University of Aeronautics & Astronautics,2011,28(1):112-119.
Authors:Yang Fushu  Sun Zhigang  Li Longbiao  Song Yingdong
Institution:(College of Energy and Power Engineering,NUAA,29 Yudao Street,Nanjing,210016,P.R.China)
Abstract:The matrix crack evolution of cross-ply ceramic matrix composites under uniaxial tensile loading is investigated using the energy balance method. Under tensile loading, the cross-ply ceramic matrix composites have five damage modes. The cracking mode 3 contains transverse cracking, matrix cracking and fiber/matrix interface debonding. The cracking mode 5 only contains matrix cracking and fiber/matrix interface debonding. The cracking stress of modes 3 and 5 appearing between existing transverse cracks is determined. And the multiple matrix crack evolution of mode 3 is determined. The effects of ply thickness, fiber volume fraction, interface shear stress and interface debonding energy on the cracking stress and matrix crack evolution are analyzed. Results indicate that the cracking mode 3 is more likely to appear between transverse cracks for the SiC/CAS material.
Keywords:ceramic matrix composites  cross-ply  matrix crack evolution  energy balance approach
本文献已被 CNKI 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号