| TC4/72Ag-28Cu 钎焊组织及Ti-Cu化合物 |
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| 引用本文： | 吴铭方,蒋成禹,于治水,梁超.TC4/72Ag-28Cu 钎焊组织及Ti-Cu化合物[J].航空材料学报,2001,21(3):29-32. |
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| 作者姓名： | 吴铭方 蒋成禹 于治水 梁超 |
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| 作者单位： | 华东船舶工业学院, |
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| 摘 要： | 在钎焊温度1103K一定的条件下,分析了钎焊时间对TC4/72Ag-28Cu/TC4钎焊接头组织及分布形态的影响.研究表明钎焊时间较短,扩散到界面的Ti、Cu在冷却过程中通过共析转变形成了Ti2Cu化合物;钎焊时间大于某一临界值,由于母材中Ti大量向钎缝中溶解及在界面Cu相对浓度的降低,使钎缝中Cu全部固溶在Ti中,最终Ti2Cu化合物消失.在此基础上提出了临界钎焊时间的概念.
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| 关 键 词： | 钎焊 组织 机理 |
| 文章编号： | 1005-5053(2001)03-0029-04 |
| 修稿时间： | 2001年7月7日 |
Microstructure of TC4/72Ag-28Cu joint and production mechanism of Ti-Cu compound at the interface |
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| WU Ming fang,JIANG Cheng Yu,YU Zhi shui,LIANG Chao.Microstructure of TC4/72Ag-28Cu joint and production mechanism of Ti-Cu compound at the interface[J].Journal of Aeronautical Materials,2001,21(3):29-32. |
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| Authors: | WU Ming fang JIANG Cheng Yu YU Zhi shui LIANG Chao |
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| Abstract: | The effect of brazing time on microstructre and morphology of joint TC4/72Ag Cu/TC4 at 1103 K was studied.based on the experimental results,it has been found that for short holding time,eutectoid transfomation took place between Ti and Cu concentrated at the interface and the compound Ti 2Cu was produced in the followed cooling stage,which limited the increase of tghe tensile strength of joints. With the increase of holding time,the joint growth mechanism of compound Ti 2Cu at the interface was studied from the point of thermodynamics. |
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| Keywords: | brazing microstructure mechanism |
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