热激励谐振式硅微结构压力传感器温度场研究

针对一种以方形硅膜片为一次敏感元件、硅梁谐振子为二次敏感元件 ;采用电阻热激励、压敏电阻拾振的压力微传感器 ,分析了其工作机理 ;依幅值、相位条件讨论了该谐振式微传感器的闭环自激系统 ;建立了微传感器的温度场模型和热应力模型 ,并进行了仿真计算与分析

On the Temperature Profile of the Thermally Excited Resonant Silicon Micro Structural Pressure Sensor

According to the sensing structure of a practical silicon resonant pressure micro sensor whose preliminary sensing unit is a square silicon diaphragm and the final sensing unit is a silicon beam resonator, its operating mechanism is analyzed. The thermal resistor acts as the excited unit, and the piezoresistive unit acts as the detector, for the above micro sensor. By using the amplitude and phase conditions, the self exciting closed loop system is investigated based on the operating mechanism for the above micro sensor. The temperature profile model and the thermal stress model are established for the beam resonator of the micro sensor. Moreover, the thermal feature is simulated and analyzed for the above micro sensor.