| 印刷锡膏工艺参数的优化 |
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| 引用本文： | 关晓丹,张昕,何世贤.印刷锡膏工艺参数的优化[J].华北航天工业学院学报,2007(1). |
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| 作者姓名： | 关晓丹 张昕 何世贤 |
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| 作者单位： | 北华航天工业学院电子工程系，廊坊职业技术学院，廊坊职业技术学院 河北 廊坊 065000，河北 廊坊 065000，河北 廊坊 065000 |
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| 摘 要： | 印刷锡膏是表面组装生产中的第一道工序,也是最关键的工序,在表面组装生产中60％～70％的焊接缺陷与锡膏的印刷有关。本文将讨论与锡膏印刷有关的问题,包括锡膏参数和印刷机(特别是与刮刀有关的)参数,并对这些参数进行优化,以达到最好的锡膏涂布效果。
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| 关 键 词： | 表面组装 锡膏 印刷机 |
Optimizing of Parameters about Stencil Printing |
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| GUAN Xiao-dan ZHANG Xin HE Shi-xian.Optimizing of Parameters about Stencil Printing[J].Journal of North China Institute of Astronautic Engineering,2007(1). |
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| Authors: | GUAN Xiao-dan ZHANG Xin HE Shi-xian |
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| Abstract: | Stencil printing is the first working procedure in surface mount processes and it is the most important part of all the operations . About 60%-70% jointing objections in surface mount processes relate to it. In this article, the problems involved in the process of stencil printing are refered to. And it mainly introduces parameters of solder paste and printing machines(especially the parameters related to scraper). Futhermore, this article introduces how to select proper values in these parameters to get the best printing effects in practice. |
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| Keywords: | surface mount process solder paste printing machine |
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