| 双酚A型环氧树脂/DDS固化剂体系的流变特性及其黏度模型研究 |
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| 引用本文： | 石凤,段跃新,曾秀妮,梁志勇,张佐光.双酚A型环氧树脂/DDS固化剂体系的流变特性及其黏度模型研究[J].航空学报,2005,26(5):610-616. |
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| 作者姓名： | 石凤 段跃新 曾秀妮 梁志勇 张佐光 |
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| 作者单位： | 1. 北京航空航天大学,材料科学与工程学院104教研室,北京,100083
2. 北京航空航天大学,材料科学与工程学院104教研室,北京,100083;Florida Advanced Center for Composite Technologies, FAMU-FSU College of Engineering,Tallahassee, FL 32310-6046 |
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| 基金项目： | 国家973计划(2003CB615602)资助项目 |
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| 摘 要： | 通过DSC和黏度测量,研究了反应型固化剂DDS(二氨基二苯基砜)用量对双酚A环氧树脂体系黏度变化的影响规律。研究结果表明,流变特性与固化特性随固化剂用量的变化规律相似。DDS的用量在一定范围内对环氧树脂体系流变特性影响不大。建立了环氧树脂工程黏度模型,该模型能够有效的预测体系黏度变化的工艺窗口并进行黏度预报,为复合材料成型工艺的顺利实施以及工艺参数的科学制定提供基础。
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| 关 键 词： | 双酚A型环氧树脂 反应固化剂 黏度模型 工艺窗口 |
| 文章编号： | 1000-6893(2005)05-0610-07 |
| 修稿时间： | 2005年1月20日 |
Rheological Behaviors and Viscosity Model of Bisphnol-A Epoxy/DDS Resin System |
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| SHI Feng,DUAN Yue-xin,ZENG Xiu-ni,LIANG Zhi-yong,ZHANG Zuo-guang.Rheological Behaviors and Viscosity Model of Bisphnol-A Epoxy/DDS Resin System[J].Acta Aeronautica et Astronautica Sinica,2005,26(5):610-616. |
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| Authors: | SHI Feng DUAN Yue-xin ZENG Xiu-ni LIANG Zhi-yong ZHANG Zuo-guang |
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| Institution: | 1. Faculty 104, School of Material Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100083, China;2. Florida Advanced Center for Composite Technologies, AMU-FSU College of Engineering, Tallahassee, FL 32310-6046, USA |
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| Abstract: | The effects of DDS curing agent ratio on the curing kinetic and viscosity of a DDS/bisphnol-A epoxy resin system are experimentally studied by DSC analysis and viscosity measurements. The results show that the DDS ratio has little effect on rheological behavior of resin system in a certain range. An engineering viscosity model is succefully developed to predict resin rheological behaviors of the resin system based on the viscosity measurement results and mechanisms of the curing reaction. The established model can be used to predict the processing windows of different viscosity requirements, which is critical for the simulation and optimization of composite manufacturing processes. |
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| Keywords: | bisphnol-A epoxy resin reaction curing agent viscosity model processing windows |
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