带集中热源的散热器温度场的数值分析

随着大规模集成电路的发展,电子设备的封装体积越来越小,功率却越来越大,这就使电子设备的温度日益增高,而电子设备的可靠性又与温度密切相关,良好的散热是电子设备应用中重要的一环.本文以通用的矩形翅片式散热器来对比带集中热源和带平均热源的散热器的温度差异,提出以嵌入热管的方法来解决带集中热源散热器的散热难题,并运用IcEPEK软件对其可行性进行了验证.

Numerical Analysis of Temperature Field with Heat. Transfer of a Concentrated Heat-Resource

With the development of integrated circuit, the volumes of electronic equipment become increasingly smaller, while their power is growing larger, and that causes the increase of the temperature of electronic equipment. Because the reliability of electronic equipment is closely related to their temperature, their ability of heat-transfer has become the key to their corresponding application. This paper clarifies the temperature distribution of concentrated heat-resource and average counterpart through the comparison of the common rectangle chinned heat-transfer. It also provides a method of inserted heat - tube as the solution to concentration of heat-resource, and meantime uses ICEPEK software to testify its feasibility.