电容搪锡微裂纹原因分析及预防对策

就CC4L型高频多层瓷介电容器在手工搪锡生产过程中本体出现微裂纹、引线松动的问题,从电容的结构、特性和制造工艺等方面分析了裂纹产生的原因,并设计了五组试验对裂纹原因进行分析验证,结果表明,裂纹产生的原因是搪锡时温度过高,搪锡时间过长,并在引线上加了不恰当的外力;同时提出了预防裂纹产生的操作工艺要点。

Analysis and Countermeasure of Micro-Crack in Capacitor Tinning

This article analyse the reason why micro-crack and lead loosing appeared on CC4L high frequency
maltilayer ceramic capacitor during the manufacture process of the capacitor and tinning with handwork and other way.
The results of five groups tests indicate that the cracks were caused by high temperature,long tinning time and unapt
force to the lead. At last,the main operating method is pointed out to prevent the cracks.