基于光敏树脂分析的3D打印加速度传感器设计

MEMS加速度传感器所采用的硅微机械加工技术存在个性化定制、小批量生产成本方面的不足，而3D打印技术的优势就在于无需模具的自由化定制、一机多用实现低成本产品生产，3D打印的发展趋势就是实现微纳尺度结构的制造。在此背景下，采用光固化立体成型技术设计了一种3D打印压阻式加速度传感器结构。传感器基底使用耐高温光敏树脂制作，并采用丝网印刷工艺在基底表面印制导电碳浆形成应变计结构。为此，首先对耐高温光敏树脂的相关热学与机械性能进行分析。通过测试，得到该光敏树脂固化后的起始分解温度等热力学参数。其次，通过控制光敏树脂紫外光固化时间，取得了较好杨氏模量和弯曲强度的树脂，且为该加速度传感器的结构仿真优化与制作工艺提供了必需数据与重要依据。除此之外，还对所设计的碳浆应变计结构进行了测试，得到了有效灵敏系数。通过以上工作，为最终实现3D打印加速度传感器的制作做好铺垫，助力3D打印技术与MEMS传感器技术相融合。

3D Printing Acceleration Sensor Design Based on Photosensitive Resin Analysis

Silicon micromachining technology used in MEMS acceleration sensor has some shortages such as personalized customization and small batch production cost. The advantage of 3D printing technology lies in the free customization without moulds and the realization of low-cost product manufacture with multi-use of one machine. The development trend of 3D printing is to realize the manufacture of micro-nano-scale structure. In this paper, a 3D printing piezoresistive acceleration sensor structure is designed by using photocuring stereoforming technology. The sensor substrate is made of a high temperature resistant photosensitive resin, and a conductive carbon slurry is printed on the surface of the substrate by a screen printing process to form a strain gauge structure. To this end, the thermal and mechanical properties of high temperature resistant photosensitive resins are analyzed firstly. Through testing, the thermodynamic parameters such as the initial decomposition temperature of the photosensitive resin after curing are obtained. Secondly, by controlling the ultraviolet curing time of the photosensitive resin, a resin having a good Young''s modulus and bending strength is obtained, which provides the necessary data and important basis for the structure simulation optimization and fabrication process of the acceleration sensor. In addition, the structure of carbon slurry strain gauge is tested and the effective sensitivity coefficient is obtained. Through the above work, the way for the final realization of the 3D printing acceleration sensor is paved. It is helpful to the integration of 3D printing technology and MEMS sensor technology.