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NY9200G树脂体系非等温DSC法固化动力学研究
引用本文:杨光,龙国荣.NY9200G树脂体系非等温DSC法固化动力学研究[J].洪都科技,2006(3):37-41.
作者姓名:杨光  龙国荣
作者单位:1. 南昌航空工业学院材料学院
2. 洪都航空工业集团
摘    要:通过非等温DSC法测试研究热熔法预浸料用NY9200G树脂体系的固化动力学,讨论了升温速率对固化特征温度的影响;用kissinger公式以及Crane公式计算得到了表观活化能、固化反应级数以及频率因子等固化动力学参数,为模拟固化反应动力学模型奠定了基础。

关 键 词:非等温  DSC  环氧树脂  固化动力学
修稿时间:2006年7月6日

Cure Kinetics of NY9200g Resin System Studied By non - Isothermal Dsc
Yang Guang,Long Guorong.Cure Kinetics of NY9200g Resin System Studied By non - Isothermal Dsc[J].Hongdu Science and Technology,2006(3):37-41.
Authors:Yang Guang  Long Guorong
Institution:Department of materials of Nanchang Lnstitute of Aeronautical Technology Hongdu Aviation Industry Group
Abstract:In this paper, the cure kinetics of NY9200G resin system applied for pre-preg process in heat-melting method is investigated by means of non-isothermal differential scanning calorimetric (DSC), and the influence of heating rate on curing characteristics temperature is discussed. The cure kinetics parameters such as activation energy, reaction order and pre-exponential factor are obtained by Kissinger and Crane formula, which establishes the basis for simulating the cure reaction kinetics model.
Keywords:Non-isothermal DSC Epoxy resin Cure kinetics
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