热管散热模组在机载电子设备热设计中的应用

针对机载电子设备的高热流密度和关键器件的高功耗,采用相变传热的微热管散热技术,在保持原受限空间和模块安装方式的前提下,研制出不同结构形式的热管散热模组。其结果证明,在满足机载使用要求和工作条件下,热管散热模组能有效解决高功耗器件的散热问题,实现电子模块的控温和均温,突破了机载电子设备结构热设计的瓶颈。本文结合实例从微热管结构对传热性能的影响研究、热管散热模组研制、数值模拟等方面介绍热管散热模组在机载电子设备热设计中的应用,为微热管散热技术在机载电子产品领域的工程应用提供了重要的参考价值。

Application of Thermal Pipe Module in Airborne Electronics Design

In order to solve the problem that airborne electronic equipments suffer from high heat flow density and high power consumption of some critical components, micro heat pipe technology with phase change heat transfer is introduced. Heat pipe thermal modules of different structures are developed in the original limited space and with the same module mounting method. Results show that in proper airborne operation condition, heat pipe thermal module is able to solve the heat dissipation problem caused by high power consumption components. As a result, electronic module temperature can be properly controlled and maintained, which is a breakthrough in the area of airborne electronic equipment thermal structure design. In this paper, heat pipe module application in airborne electronics heat design is introdud~d from the perspective of micro heat pipe structure impact on thermal performance, heat pipe module development and numerical simulation, playing a significant role in the field of airborne electronics engineering.