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| 混装电路板焊接工艺设计 | |
| 引用本文： | 徐冬霞,韩飞. 混装电路板焊接工艺设计[J]. 航空精密制造技术, 2011, 47(5): 55-56,59 |
| 作者姓名： | 徐冬霞 韩飞 |
| 作者单位： | 1. 南理工大学材料科学与工程学院,焦作,454000 2. 中兵光电科技股份有限公司,北京,100176 |
| 摘 要： | 本文以某产品的混装电路板手工焊接为例,介绍了混装电路板焊接工艺设计的过程,包括工艺设计的依据、焊接方法的选择以及工艺设计的要点,可作为今后类似产品的设计依据和参考. |
| 关 键 词： | 混装电路板 手工焊接 工艺设计 |
Process Design of Soldering for Mix-assembled Circuit Board |
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| XU Dong-xia,HAN Fei. Process Design of Soldering for Mix-assembled Circuit Board[J]. Aviation Precision Manufacturing Technology, 2011, 47(5): 55-56,59 | |
| Authors: | XU Dong-xia HAN Fei |
| Affiliation: | XU Dong-xia,HAN Fei(1.College of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,2.China north optical-electrical technology co.,ltd,Beijing 100176) |
| Abstract: | Manual iron soldering of certain mix-assembled circuit board product was used as an example,process design of soldering for mix-assembled circuit board was introduced,including criteria of soldering procedure,choice of soldering method and key points of process design.It could serve as a basis and reference for process design of like products in future. |
| Keywords: | mix-assembled circuit board manual iron soldering process design |
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