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混装电路板焊接工艺设计
引用本文:徐冬霞,韩飞.混装电路板焊接工艺设计[J].航空精密制造技术,2011,47(5):55-56,59.
作者姓名:徐冬霞  韩飞
作者单位:1. 南理工大学材料科学与工程学院,焦作,454000
2. 中兵光电科技股份有限公司,北京,100176
摘    要:本文以某产品的混装电路板手工焊接为例,介绍了混装电路板焊接工艺设计的过程,包括工艺设计的依据、焊接方法的选择以及工艺设计的要点,可作为今后类似产品的设计依据和参考.

关 键 词:混装电路板  手工焊接  工艺设计

Process Design of Soldering for Mix-assembled Circuit Board
XU Dong-xia,HAN Fei.Process Design of Soldering for Mix-assembled Circuit Board[J].Aviation Precision Manufacturing Technology,2011,47(5):55-56,59.
Authors:XU Dong-xia  HAN Fei
Institution:XU Dong-xia,HAN Fei(1.College of Materials Science and Engineering,Henan Polytechnic University,Jiaozuo 454000,2.China north optical-electrical technology co.,ltd,Beijing 100176)
Abstract:Manual iron soldering of certain mix-assembled circuit board product was used as an example,process design of soldering for mix-assembled circuit board was introduced,including criteria of soldering procedure,choice of soldering method and key points of process design.It could serve as a basis and reference for process design of like products in future.
Keywords:mix-assembled circuit board  manual iron soldering  process design  
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