电解铜箔材料中晶面择优取向

采用含有硫脲、明胶添加剂的硫酸盐电沉积体系,利用X射线衍射仪(XRD)、万能试验机等手段研究了不同电沉积条件下制备的铜箔材料的择优取向特征及其对铜箔机械性能的影响.结果表明,较大电流密度下,以硫脲为添加剂生产的电解铜箔出现(220)面择优取向,织构程度受到铜箔厚度、电流密度影响,最大织构系数TC(220)达到93.2％.此外,铜箔发生择优取向与添加剂有关,相同条件下,以骨胶为添加剂生产的电解铜箔未出现明显的择优取向特征.同时,铜箔表面并没有出现择优晶向,保证了铜箔沿平面方向上抗拉强度及延伸率的稳定. 

Preferred orientation of electrolytic copper foil

Preferred orientation of copper foil which was electrodeposited under different conditions in electrolyte solution containing thioureas,glue additives was studied by X-ray diffraction(XRD), all-purpose material testing machine.The results showed that the copper foil which was electrodeposited in electrolyte solution containing thioureas has the character of preferential orientation (220),the extent of the texture was influenced by the thickness and current density.the peak of TC(220) was 93.2%.The kind of additives has influence on the texture.The foil produced in electrolyte solution containing glue has no evidently character of preferential orientation.The tensile strength and elongation paralleling the surface of the foil are at the same level in different orientation.