| 旋转条件下SiC 单晶片锯切力建模研究 |
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| 引用本文： | 王肖烨,李言.旋转条件下SiC 单晶片锯切力建模研究[J].宇航材料工艺,2011,41(4). |
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| 作者姓名： | 王肖烨 李言 |
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| 作者单位： | 1. 西安理工大学机械与精密仪器工程学院,西安710048;宝鸡文理学院机电工程系,宝鸡721007
2. 西安理工大学机械与精密仪器工程学院,西安,710048 |
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| 基金项目： | 陕西省机械制造及装备重点实验室项目(08JZ46); 陕西省教育厅重点实验室建设基金(09JS099); 陕西省科技攻关项目(2010K09-1); 宝鸡文理学院院级重点项目(ZK06117) |
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| 摘 要： | 通过理论分析和实验研究相结合的方法,对工件旋转条件下电镀金刚石线锯切割SiC单晶片锯切力进行了分析.依据磨削和动态切削理论,分析了线锯与工件运动模型、单颗金刚石磨粒的切向和法向锯切力,建立了金刚石线锯锯切力模型；进行了工件旋转条件下SiC单晶切割实验,对理论分析结果进行验证,重点对线锯速率、工件进给速率、工件旋转速率及工件未切割直径等工艺因素对切向锯切力的影响进行分析.结果表明理论分析和实验结果相对误差不大于5.2％,验证了所建模型的正确性,为探索SiC单晶片的切削机理和参数优化提供依据.
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| 关 键 词： | 工件旋转 SiC单晶片 锯切力 建模研究 |
Modeling of SiC Wafer Sawing Force Under Rotating Condition |
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| Wang Xiaoye,Li yan.Modeling of SiC Wafer Sawing Force Under Rotating Condition[J].Aerospace Materials & Technology,2011,41(4). |
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| Authors: | Wang Xiaoye Li yan |
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| Institution: | Wang Xiaoye1,2 Li yan1(1 Faculty of Mechanical and Precision Instrument Engineering,Xi'an University of Technology,Xi'an 710048)(2 Mechanical Engineering Department,Baoji University of Arts and Science Electronic,Baoji 721007) |
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| Abstract: | In this paper,theoretical analysis and experiment verification were combined to analyze the sawing force of SiC wafer cut with electroplated diamond wire saw under workpiece rotating condition.Based on the grinding and dynamic cutting theory,the motion model of wire saw and workpiece,the radial and tangential force of a single diamond grain were analyzed,and then the SiC wafer sawing force model was built.The SiC wafer sawing experiments with workpiece rotating were carried out to verify the theoretical ana... |
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| Keywords: | Workpiece rotate SiC wafer Sawing force Modeling study |
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