| 电子产品中铅焊接金脆问题浅析 |
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| 引用本文： | 周传君,周岭,马娜,王智斌,张绍东.电子产品中铅焊接金脆问题浅析[J].宇航材料工艺,2019,49(4):7-10. |
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| 作者姓名： | 周传君 周岭 马娜 王智斌 张绍东 |
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| 作者单位： | 航天东方红卫星有限公司,北京 100094 |
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| 摘 要： | 针对航天电子产品广泛采用的Sn-Pb焊料在镀金表面焊接形成焊点的工艺,分析了工业及国内外航天相关标准文件中对焊接后焊点中含金量的要求以及焊点含金量、时效、器件不同封装形式对焊点可靠性的影响,并深入分析了合金焊点金相组织结构,最后介绍了一般去金工艺要求与去金不到位而导致器件失效案例。
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| 关 键 词： | 金脆 含金量 时效 器件封装 去金 |
| 收稿时间： | 2018/12/3 0:00:00 |
Analysis of Gold Brittlement Poblem With Lead Soldering of Electronic Product |
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| ZHOU Chuanjun,ZHOU Ling,MA N,WANG Zhibin,ZHANG Shaodong.Analysis of Gold Brittlement Poblem With Lead Soldering of Electronic Product[J].Aerospace Materials & Technology,2019,49(4):7-10. |
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| Authors: | ZHOU Chuanjun ZHOU Ling MA N WANG Zhibin ZHANG Shaodong |
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| Abstract: | The process of solder joints on the gold-plated surface of Sn-Pb solder was widely used in aerospace electronics. The requirements of gold content in solder joints after welding in industrial documents and domestic and foreign standards were analyzed. The influences of solder gold content, aging and different packaging forms on reliability of solder joints were analyzed and the metallographic structure of solder joints was discussed. Finally, the requirements of de-golding and failure case of inadequate de-golding were introduced. |
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| Keywords: | Gold embrittlement Gold content Timeliness Packaging De-gold |
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