| 带有接地式焊盘器件软钎焊接方法的研究 |
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| 作者姓名： | 魏东 |
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| 作者单位： | 北京遥测技术研究所 北京100076 |
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| 摘 要： | 依据软钎焊接原理,将带有接地式焊盘器件的软钎焊接方法分为手工软钎焊接方式、表面贴装技术设备软钎焊接方式、半手工加热台软钎焊接方式三类,并进行了比较研究。对使用三种不同方式进行焊接的产品,进行了焊点的力学性能试验、环境电性能试验,并使用有限元数值模拟方法对焊点在温度冲击载荷下的力学性能进行了计算分析。研究表明,半手工加热台软钎焊接方式完全满足带有接地式焊盘器件的软钎焊接需求,是一种经济可行的加工方式。
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| 关 键 词： | 软钎焊接 带有接地式焊盘器件的焊点 温度冲击载荷 裂纹 |
Soldering Methods Research on Grounded-pad Device |
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| Authors: | Wei Dong |
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| Abstract: | Three kinds of soldering methods on grounded-pad device were presented and compared in this paper.To the products soldered with the three methods,the tests of mechanical characteristic and environment electrical characteristic about solder joint had been done.The finite element numerical simulation was also made in order to attain the feature of stress-strain distribution in the solder joints under temperature cycling.The results showed that this method is feasible and economical for the grounded-pad device soldering. |
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