HALT试验高效率温度剖面图的建立

HALT是一项崭新的可靠性试验技术，具体实施还缺乏系统的理论指导。以在电子设备可靠性中起重要作用的焊点为研究对象，采用非线性有限元方法，分析了有引脚PQFP和无引脚EBGA两类典型器件的焊点在热循环载荷作用下的应力应变特点，研究了热循环试验温度剖面参数包括高低温端点温度、高低温保持时间、温变速率对这两种典型焊点的弹性应变范围、塑性应变累积、疲劳寿命和试验效率的影响，归纳了电子设备HALT可靠性试验优化温度剖面图的建立方法。

Design of the efficient temperature profile of highly accelerated life test

HALT is a new technique for reliability test.But there is few theoretical guidance on how to determine the efficient Temperature Profile at present. In this paper,the solder joints whose fatigue is the most common reliability problem in advanced electronic equipment are used as the objects of the study,the stress/strain distribution characteristics of the leaded PQFP solder joint and the leadless EBGA solder joint under thermal cycling loading is analyzed using the nonlinear finite element method,and the influence of the temperature profile parameters (e.g.the temperature range,the ramp rate and the length of dwell time) on the range of elastic strain,plastic strain accumulation,fatigue life and test efficiency of solid joint are studied.At last,the method for designing the optimal temperature profile are summarized.