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新型含硅芳炔树脂复合材料制备工艺
引用本文:黄,琛,周,燕,邓,鹏,黄发荣,杜,磊.新型含硅芳炔树脂复合材料制备工艺[J].宇航材料工艺,2010,40(2).
作者姓名:            黄发荣    
作者单位:华东理工大学特种功能高分子材料及相关技术教育部重点实验室,上海,200237
摘    要:以含硅芳炔树脂为基体、高强玻璃布为增强材料制备了新型含硅芳炔树脂复合材料,探讨了树脂的固化工艺,研究了树脂含量、成型温度和成型压力对复合材料性能的影响,确定了含硅芳炔树脂复合材料成型的工艺参数:树脂质量分数31%、升温程序170℃/2h+210℃/2h+250℃/4h、成型压力1.0MPa。优化工艺条件下制备的复合材料弯曲强度达278MPa。

关 键 词:含硅芳炔树脂  成型工艺  高性能复合材料

PreparationofNewSilicon-Containing ArylacetyleneResinComposites
Institution:KeyLaboratoryofSpecialFunctionalPolymericMaterialsandRelatedTechnologyoftheMinistryofEducation,EastChinaUniversityofScienceandTechnology,Shanghai 200237
Abstract:New glass fiber reinforced silicon-containing arylacetylene resin(SCAR) composites were prepared from SCAR and glass fiber cloth. The influence of the resin content, molding temperature and molding pressure on the flexural properties of the composites was investigated. On the basis of the determined curing process, the optimum manufacturing conditions for the SCAR composites were obtained as follows : the molding pressure 1.0 MPa, the resin content 31% wt and temperature procedure 170℃/2 h +210℃/2 h +250℃/4 h. The flexural strength of the composite reach 278 MPa.
Keywords:Silicon-containing arylacetylene resin (SCAR)  Molding technology  High performance composite
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