层间叉排微针肋液体冷却3D-IC流动及换热特性

用数值模拟的方法,研究了散热面积为1cm2带有层间微散热结构双面均热发热3D-IC内部流体层流流动与换热,对体积流量在36~290mL/min范围内,通道高度为200μm,通道间距为200μm的带有矩形微通道和叉排微针肋液体冷却3D-IC(three-dimensional integration circuit)的流动与换热进行了分析.结果表明:带有层间叉排微针肋液体冷却3D-IC具有良好的换热效果,在热流密度为1.25MW/m2,体积流量为290mL/min时,其发热面平均温度、最大温度只有318.31,323.16K,分别最大减小了12.31,20.14K,此时的功率为250W、体积热源为8.3kW/cm3. 

Flow and heat transfer characteristics for inter-layer liquid cooling of 3D-IC with staggered micro-pin fins

The laminar flow and heat transfer characteristics of fluid were numerically investigated through uniform and double-side heat flux 3D-IC ( three-dimensional integration circuit) with interlayer heat-removal structure for heat transfer areas of 1cm2 and volume flow ringing from 36mL/min to 290mL/min. 3D-IC with rectangle micro-channels and staggered micro-pin fins for pitches of 200μm and structure heights of 200μm was analyzed. Results show that inter-layer liquid cooling of 3D-IC with staggered micro-pin fins has better heat exchange effect than that with rectangle micro-channels. For the heat flux density of 1.25MW/m2,the average temperature and maximum temperature of the heating surface are only 318.31,323.16K, decreased 12.31,20.14K than that with rectangle micro-channels at the volume flow of 290mL/min, corresponding to about total power of 250W and volume heat source of 8.3kW/cm3.