| Semi-analytic Solution of Steady Temperature Fields During Thin Plate Welding |
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| 引用本文： | DAI Yao TAN Wei SUN Qi SUN Chang-qing. Semi-analytic Solution of Steady Temperature Fields During Thin Plate Welding[J]. 中国航空学报, 2006, 19(B12): 248-251 |
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| 作者姓名： | DAI Yao TAN Wei SUN Qi SUN Chang-qing |
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| 作者单位： | [1]Department of Mechanical Engineering, Armored Force Engineering College, Beijing 100072, China [2]Department of Materials Science and Engineering, Armored Force Engineering College, Beijing 100072, China |
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| 基金项目： | National Natural Science Foundation of China （50574097; 90305023） |
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| 摘 要： | ![]()
Usually, it is very difficult to find out an analytical solution to thermal conduction problems during high temperature welding. Therefore, as an important numerical approach, the method of lines （MOLs） is introduced to solve the temperature field characterized by high gradients. The basic idea of the method is to semi-discretize the governing equation of the problem into a system of ordinary differential equations （ODEs） defined on discrete lines by means of the finite difference method, by which the thermal boundary condition with high gradients are directly embodied in formulation. Thus the temperature field can be obtained by solving the ODEs. As a numerical example, the variation of an axisymmetrical temperature field along the plate thickness can be obtained.
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| 关 键 词： | 薄板 焊接过程 稳定温度场 半解析解 |
| 收稿时间： | 2006-08-10 |
| 修稿时间： | 2006-11-06 |
Semi-analytic Solution of Steady Temperature Fields During Thin Plate Welding |
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| Abstract: | ![]()
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| Keywords: | steady temperature field method of lines thin plate welding semi-analytic solution high gradient |
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