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一种改善防渗碳性能的脉冲镀铜工艺优化
引用本文:李晗晔,孙慧艳,袁福河.一种改善防渗碳性能的脉冲镀铜工艺优化[J].航空制造技术,2017(15).
作者姓名:李晗晔  孙慧艳  袁福河
作者单位:中国航发沈阳黎明航空发动机有限责任公司,沈阳,110043
摘    要:为了实现对航空发动机零件非渗碳区域的有效防护,需要进行局部镀铜工艺的优化。通过脉冲镀铜正交试验和镀层孔隙率极差分析,确定了脉冲镀铜的主要和次要影响参数,优化了脉冲镀铜工艺参数。优化工艺脉冲制备的铜镀层结合力良好,表面形貌、孔隙率、防渗效果均优于直流镀铜层,将镀铜厚度由50~70μm降低到20μm,节约镀铜成本,且提高了工作效率。

关 键 词:正交试验  电镀  脉冲  孔隙率  防渗碳

Optimization of a Pulse Electorplating Copper Process for Improving Carburization Resistance
LI Hanye,SUN Huiyan,YUAN Fuhe.Optimization of a Pulse Electorplating Copper Process for Improving Carburization Resistance[J].Aeronautical Manufacturing Technology,2017(15).
Authors:LI Hanye  SUN Huiyan  YUAN Fuhe
Abstract:A copper electroplating process is optimized to realize an effective local protection of non-carbufization areas of aeroengine components.The primary,minor parameters of a pulse electroplating copper process are identified and optimized in the present work through orthogonal experiment and range analysis.The copper plating deposited using the Optimized pulse process demonstrates an excellent interface adhesion state,with surface morphology,porosity and carburization resistance better than that electroplated using a direct current.The thickness of the copper plating might be decreased to 20μm from 50-70μm using the optimized pulse electroplating copper process,thereby saves the cost and enhance the efficiency of copper electrolplating production.
Keywords:Orthogonal experiment  Electroplating  Pulse  Porosity  Anti-carburizing
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