| 氧化铝的直接电镀 |
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| 引用本文： | Jillek,W 祝晔南.氧化铝的直接电镀[J].上海航天,1999,16(5):37-42. |
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| 作者姓名： | Jillek W 祝晔南 |
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| 作者单位： | 德国纽伦堡欧姆工业学院(WernerJillek，ManfredBrunnacker)，上海航天技术研究院813所!上海200086(祝晔南) |
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| 基金项目： | 德国巴伐利亚研究基金会的资助 |
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| 摘 要： | 讨论了在氧化铝基板上的厚膜应用领域中采取直接电镀的方法。研究了建立在钯涂层、碳涂层和导电聚合物基础上的三种直接电镀的方法，测定和比较了它们与传统电镀／ 化学镀技术的操作步序、电镀速度和膜层结合力等技术指标。
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| 关 键 词： | 直接电镀 氧化铝陶瓷 激光辅助沉积 |
DIRECT PLATING OF ALUMINA |
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| Werner Jillek,Manfred Brunnacker,ZHU Ye nan.DIRECT PLATING OF ALUMINA[J].Aerospace Shanghai,1999,16(5):37-42. |
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| Authors: | Werner Jillek Manfred Brunnacker ZHU Ye nan |
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| Abstract: | This paper discusses the application of direct plating method, originally developed for PCBs, to alumina thick film substrates. Three direct plating technologies, i.e. palladium coating, carbon coating and conductive polymers were investigated. Process handling, plating speed and adhesion strength of the metallization were determined and compared with the results achieved by the conventional electroless/electroplating technology. |
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| Keywords: | Direct plating Alumina ceramic substrate Laser deposition |
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