| 电子封装铝基复合材料热循环曲线研究 |
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| 引用本文： | 喻学斌,张国定.电子封装铝基复合材料热循环曲线研究[J].航空材料学报,1995,15(1):15-21. |
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| 作者姓名： | 喻学斌 张国定 |
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| 作者单位： | 上海交通大学复合材料研究所 |
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| 摘 要： | 研究了热循环对铝基复合材料热膨胀和冷却收缩曲线的影响。发现电子封装纤维增强铝基复合材料的热循环曲线是不封闭的。热循环曲线的形状、不封闭程度同增强体的种类、测试方向、热循环温度区间以及热循环次数等因素有关。利用细观力学理论较好地解释了这些现象。
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| 关 键 词： | 铝基复合材料，温度循环试验，热膨胀，电子封装 |
INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING |
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| Yu Xuebin, Zhang Guoding, Wu Renjie.INVESTIGATION OF THERMAL CIRCLING CURVE OFAL UMINUM-MATRIX COMPOSITES FORELECTRONIC PACKAGING[J].Journal of Aeronautical Materials,1995,15(1):15-21. |
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| Authors: | Yu Xuebin Zhang Guoding Wu Renjie |
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| Abstract: | The effects of thermal circling on the curve of heat expansion and cold contraction are investigated. Itis found that the thermal circling curves of aluminum-matrix composites reinforced with carbon fiber forelectronic packaging are not close. The curve shape and close extent of thermal circling are related to rein-forcernents ,sarnple orientation ,thermal circling number of times and temperature range. These phenomenaare explained by micro-mechanics. |
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| Keywords: | aluminum-matrix composites thermal circling tests thermal expansion elec-tronic packaging |
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