| 喷射成形电子封装Si-Al合金凝固过程模拟研究 |
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| 引用本文： | 尧军平,杨滨,张磊,陈美英,张济山.喷射成形电子封装Si-Al合金凝固过程模拟研究[J].南昌航空工业学院学报,2004,18(1):5-9. |
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| 作者姓名： | 尧军平 杨滨 张磊 陈美英 张济山 |
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| 作者单位： | [1]南昌航空工业学院材料科学与工程系,江西南昌330084 [2]北京科技大学新金属材料国家重点实验室,北京100083 |
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| 基金项目： | 江西省材料科学与工程研究中心开放基金课题（ZX200301004）. |
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| 摘 要： | 为了优化喷射成形Si—Al合金成形工艺，获得优良的显微组织，本文模拟了喷射成形Si-30wt％ Al合金的凝固过程。研究了雾化压力和沉积距离对熔滴冷却过程中的温度和固相分数的影响。模拟计算结果得到实验验证。
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| 关 键 词： | 喷射成形 电子封装 Si—Al合金 凝固分析 |
| 文章编号： | 1001-4926(2004)01-0005-05 |
| 收稿时间： | 2003-11-10 |
| 修稿时间： | 2003年11月10 |
Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials |
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| YAO Jun-ping, YANG Bin, ZHANG Lei, CHEN Mei-ying, ZHANG Ji-shan.Simulation of solidification behavior in spray-deposited Si-Al preforms used for electronic packaging materials[J].Journal of Nanchang Institute of Aeronautical Technology(Natural Science Edition),2004,18(1):5-9. |
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| Authors: | YAO Jun-ping YANG Bin ZHANG Lei CHEN Mei-ying ZHANG Ji-shan |
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| Institution: | 1. Department of Materials Science and Engineering, Nanchang Institute of Aeronautical Technology, University, Nanchang 330029, P.R. China |
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| Abstract: | To optimize the spray forming process and obtain desired Si - Al preform microstructures, it is essential to make a full understanding of the solidification process of the alloys. In this study, a numerical simulation of solidification behavior for spray-deposited Si - 30wt% Al preforms has been calculated and discussed. The influence of atomization pressure and axial distance on the Si - 30wt%Al droplet temperature and solid fraction was discussed. The calculated results of numerical simulation for the alloy have been verified to be accurate. |
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| Keywords: | Spray forming Electronic packaging Si- Al alloys Solidification analysis |
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