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组合材料芯片技术应用及Zn-Al合金镀层材料优选
引用本文:刘茜,陈伟,刘庆峰,归林华,朱丽慧,王利.组合材料芯片技术应用及Zn-Al合金镀层材料优选[J].空间科学学报,2009,29(1).
作者姓名:刘茜  陈伟  刘庆峰  归林华  朱丽慧  王利
作者单位:1. 中国科学院上海硅酸盐研究所,高性能陶瓷和超微结构同家重点实验室,上海,200050
2. 上海大学材料工程系
3. 宝山钢铁股份有限公司汽车板研究所
基金项目:上海市科学技术委员会科技攻关项目 
摘    要:基于组合材料芯片技术原理,通过离子束溅射方法,在低碳钢基片上快速制备了全组份范围的二元Zn-Al薄膜材料样品库,研究了不同热处理条件对薄膜组份互扩散过程的影响.使用XRD及EDS等手段表征薄膜的成分和结构,并采用原子力显微镜和透射电了显微镜观察形貌;使用纳米压痕仪测试材料芯片样品的压痕硬度和弹性模量;使用电化学方法测试平衡电位和极化电阻.在获得薄膜材料样品组成-结构-性能(力学性能和耐腐蚀性能)关联特性的基础上,对具有良好力学性能和耐腐蚀性能的二元Zn-A1合金镀层材料提出了成分设计和优化方案,即选择兼具良好力学性能和耐蚀性能的Al-Zn镀层材料,成分配比应控制为约30at%Zn含量.

关 键 词:组合材料芯片技术  Zn-Al合金薄膜  力学性能  耐腐蚀性能

Application of Combinatorial Materials Approach for Fast Screening of Zn-A1 Alloy Films
LIU Qian,CHEN Wei,LIU Qingfeng,GUI Linhua,ZHU Lihui,WANG Li.Application of Combinatorial Materials Approach for Fast Screening of Zn-A1 Alloy Films[J].Chinese Journal of Space Science,2009,29(1).
Authors:LIU Qian  CHEN Wei  LIU Qingfeng  GUI Linhua  ZHU Lihui  WANG Li
Institution:State Key Laboratory of High Performance Ceramics and Superfine Microstructure;Shanghai Institute of Ceramics;Chinese Academy of Sciences;Shanghai 200050;Department of Materials Engineering;Shanghai University;Automotive Steel Sheets Institute;Baoshan Iron and Steel Company Limited
Abstract:A combinatorial method was used to deposit a Zn-Al material library on a low car- bon steel substrate by ion beam sputtering.As-deposited film samples were annealed at varied heat treatment conditions to promote the diffusion between the elements for a through-thickness homogenous sample.XRD and EDS analyses were carried out for composition and structure,AFM and TEM images were obtained for morphology observation.Nanoindentation tests were conducted to investigate the mechanical behaviour of samples.Electro...
Keywords:Combinatorial method  Zn-Al alloy film  Mechanical property  Anti-corrosion  
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