航空发动机电子控制系统的小型化SIP技术

针对电子装备小型化的需求,开展了对航空发动机电子控制系统的系统级封装(SIP)技术研究.以一个航空发动机电子控制系统设计为例,采用芯片堆叠结构,将多个裸芯片管脚用键合线引至电路衬底上的连接点,辅以印制板电路,构成完整的电路系统.通过设计优化和信号完整性仿真分析来控制信号质量,试验验证了在保证电路板信号质量的情况下,采用SIP技术,面积缩小约80%,质量减少约70%.研究显示系统级封装技术是未来航空电子控制系统小型化、高可靠的发展方向之一.

System-in-package technology for miniaturization design of aero-engine electronic control system

An advanced technology of system-in-package(SIP) was presented for miniaturization of the aero-engine control system's electronic equipments.The circuit design of an aero-engine electronic control system was taken as an example.In the chip, an integrated approach was adopted based on a pile of integrated chips,and internal die pins were led to the connection points on the circuit underlay;then the surrounding was supplemented by printed circuit board;finally a complete electrical system was constituted.Design optimization and signal integrity simulation were implemented for quality control of signals.The test results show that,by use of SIP technology,the circuit board is reduced about 80% in area and 70% in mass as well as the signal quality is satisfied.The research illustrates that the SIP technology becomes one of the development directions of miniaturization and high reliability design of aero-engine electronic control system in the future.