| 不同中间层合金对IC10合金的连接 |
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| 引用本文： | 叶雷,李晓红,毛唯,程耀永,谢永慧,陈波. 不同中间层合金对IC10合金的连接[J]. 航空材料学报, 2006, 26(3): 319-320 |
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| 作者姓名： | 叶雷 李晓红 毛唯 程耀永 谢永慧 陈波 |
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| 作者单位： | 北京航空材料研究院,北京,100095 |
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| 摘 要： | 采用B或Zr作为降熔元素分别配制不同中间层合金,并对IC10合金进行连接.分析不同状态下焊缝组织.结果表明,含B中间层合金连接IC10时,保温时间较长可以达到等温凝固,而含Zr中间层合金在本试验条件下表现为钎焊过程.
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| 关 键 词： | IC10合金 降熔元素 等温凝固 |
| 文章编号： | 1005-5053(2006)03-0319-02 |
| 修稿时间： | 2006-02-01 |
Bonding of IC10 Alloy with Different Interlayer Alloys |
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| YE Lei,LI Xiao-hong,MAO Wei,CHENG Yao-yong,XIE Yong-hui,CHEN Bo. Bonding of IC10 Alloy with Different Interlayer Alloys[J]. Journal of Aeronautical Materials, 2006, 26(3): 319-320 |
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| Authors: | YE Lei LI Xiao-hong MAO Wei CHENG Yao-yong XIE Yong-hui CHEN Bo |
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| Abstract: | The effect of B and Zr as the melting point depressants on the melting temperature range and the bonding behaviors of IC10 alloy with the interlayer alloys were studied.The results showed that with long holding time,the bonding of IC10 with the interlayer alloy containing B was an isothermal solidification process,but for element Zr,it was only a brazing process. |
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| Keywords: | IC10 alloy melting point depressant isothermal solidification |
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