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This paper presents two transitions between microstrip and stripline in Low Temperature Co-fired Ceramic technology, including a vertical transition and a coplanar transition for millimeter-wave application. These interconnects are simulated and optimized by a three-dimensional electromagnetic field simulator. Simulation results show that the return loss of microstrip to stripline vertical transition is less than −22 dB, and insertion losses are greater than 0.5 dB up to 35 GHz, and greater than 1 dB up to 40 GHz. Similarly, the return loss of the coplanar transition is less than −32 dB and insertion loss is better than 0.5 dB. LTCC test structures were fabricated and the performance of all transitions was successfully validated by scattering parameter measurements up to 40 GHz. 相似文献
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介绍了温度变化、添加剂种类与含量等因素对 AP/HTPB 推进剂断裂能影响的研究.实验结果表明,该推进剂的断裂能随温度升高而降低;键合剂可以改善推进剂的抗撕裂能力,提高其断裂能.当推进剂的粘附指数接近1时,推进剂的断裂能最大。 相似文献
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