TA15钛合金电子束焊缝形貌及其组织研究

采用不同工艺参数对TA15钛合金进行电子束焊接,通过观察焊缝形貌、测量其形状参数研究了焊接接头形貌的变化规律,并分析了焊接接头组织。结果表明:增大电子束流时,熔深、半熔深熔宽、焊缝宽度都增大,焊缝横截面的形状从"钉形"转变为"钟罩形";增大焊接速度,对焊缝形状影响不大,熔深、半熔深熔宽及焊缝宽度均减小,深宽比先增大后减小;聚焦电流的增大对熔深作用较明显,半熔深熔宽及焊缝宽度变化不大;扫描幅值的增加使焊缝熔深减小,半熔深熔宽增大。靠近母材的热影响区组织与母材组织相近,主要由初生等轴状α相及转变β相组成,并出现针状(α+β);靠近熔合线的组织由α相和针状(α+β)相构成,并出现α'马氏体;熔合区组织由α'组成,熔合线周围柱状晶垂直于焊缝中心生长,并在焊缝中心形成单列或多列的等轴状晶。     

Selective laser melting of Al–8.5Fe–1.3V–1.7Si alloy: Investigation on the resultant microstructure and hardness

This article presents the microstructure and hardness variation of an Al–8.5Fe–1.3V–1.7Si(wt%, FVS0812) alloy after selective laser melting(SLM) modification. Three zones were distinguished across the melting pool of the SLM-processed FVS0812 alloy: the laser melted zone(LMZ), the melting pool border, and the heat affected zone(HAZ) in the previously deposited area around the melting pool. Inside the LMZ, either an extremely fine cellular-dendritic structure or a mixture zone of the a-Al matrix and nanoscale Al_(12)(Fe,V)_3Si particles appeared. With a decreased laser beam scanning speed, the cellular-dendritic structure zone within the LMZ shrank significantly while the mixture zone expanded. The a-Al and Al_(12)(Fe,V)_3Si mixture zone was also observed in the HAZ, but another phase, submicron h-Al_(13)Fe_4 particles with rectangular or hexagonal shapes,formed along the melting pool border. Microhardness tests indicated that the hardness of the SLM-processed FVS0812 samples far exceeded that of the as-cast FVS0812 alloy.     

二次时效对微合金化的Al-Cu-Li 微观组织及力学性能的影响

通过常规力学性能、扫描电镜、透射电镜等测试分析方法研究了T8I6二次时效制度对Mg、Ag和Zn复合微合金化的Al-3.48Cu-1.44Li合金微观组织和力学性能的影响.结果表明,与单级时效相比,二次时效合金强度提高,而塑性略降;合金强度随第三级时效时间的延长进一步提高.最优的合金其抗拉强度(UTS)、屈服强度(YS)和延伸率分别为613.7、564.9 MPa和6.8％.合金的强化相主要为T1相,另有少量的θ'相和S'相.二次时效促进强化相,特别是T1相的二次沉淀,提高合金的强度,同时几乎不损失塑性.     

FGH96/GH4169高温合金惯性摩擦焊微观组织及演变过程

对FGH96/GH4169异质高温合金惯性摩擦焊接头组织形貌及演变过程进行分析,测量了焊接过程的界面温度。结果表明,惯性摩擦焊近界面处最高温度超过1100℃,达到母材强化相固溶温度区间。摩擦初期GH4169侧率先产生磨损颗粒;摩擦过渡期磨损颗粒被细化,摩擦界面形成高温粘塑性金属,在顶锻压力作用下开始形成飞边,夹杂物随之被挤出;准平衡摩擦阶段界面处高温粘塑性金属被持续挤出,飞边增大。焊后于焊接界面处形成等轴细晶区,细晶区与母材间为热力影响区,产生明显的变形,形貌为拉长晶粒。     

A review of friction stir joining of SiCp/Al composites

SiCp/Al composites have excellent comprehensive properties and have been widely used in aerospace, automotive industry and other fields. Due to the huge difference in performance between SiC particles and matrix alloys, traditional fusion welding methods are difficult to meet the join requirements of SiCp/Al composites. Friction stir joining (friction stir welding), as a solid phase joining process, has been proved to be a new technology with fine prospect in joining SiCp/Al composites compared with fusion welding process. Although some progress has been made in recent years, there are still full of challenges. In this paper, the research status of friction stir joining of SiCp/Al composites in recent years is expatiated, including the weldability of SiCp/Al composites, the macrostructure and the microstructure of joints, mechanical properties of joints, and tool wear and monitoring. Furthermore, the existing challenges of friction stir joining of SiCp/Al composites are summarized and the future development directions are prospected.     

热等静压对激光选区熔化成形GH4169合金持久性能的影响

采用激光选区熔化(SLM)成形技术制备了GH4169合金,运用金相显微镜(OM)、扫描电子显微镜(SEM)、电子背散射衍射(EBSD)和透射电镜(TEM)等分析手段分析了热等静压对SLM成形GH4169合金组织及持久性能的影响规律。结果表明:沉积态合金组织中,沿沉积方向的晶粒为柱状晶,晶粒内枝晶组织细小,枝晶间分布大量Laves相;热等静压处理可有效消除组织中气孔缺陷,溶解大部分Laves相,促使组织晶粒等轴化,并减少后续980℃固溶处理过程中δ相在晶内的析出;热等静压处理能提高合金的持久寿命,但会降低合金的持久塑性。     

基于Tanaka-Mura模型的电子束焊接头疲劳裂纹萌生模拟

为揭示高温合金电子束焊接头的疲劳特性,对其开展了疲劳裂纹萌生数值模拟研究。考虑焊缝区微观组织特性,对Voronoi图法进行改进,建立了焊缝区包含柱状晶、细等轴晶及粗等轴晶的混合晶区微观组织模型;对ABAQUS进行二次开发,考虑晶粒随机取向,生成晶粒多滑移带模型。基于Tanaka-Mura位错滑移模型,编写了疲劳裂纹萌生算法,考虑晶界处裂纹的连接与合并,对算法进行了改进,并结合有限元计算建立了电子束焊接头疲劳裂纹萌生数值模拟方法。基于上述方法对GH4169电子束焊接头不同载荷大小的疲劳裂纹萌生进行数值模拟,分析了裂纹萌生过程及萌生寿命,并与试验结果进行对比验证;还探讨了不同热影响区晶粒尺寸对焊接接头疲劳裂纹萌生的影响规律。结果表明,电子束焊接头疲劳裂纹均萌生于热影响区,但随着载荷水平的提高,萌生位置向熔合区一侧靠近;当热影响区晶粒尺寸与母材区晶粒尺寸越接近时,接头疲劳寿命越长。     

TIG补焊对2219铝合金搅拌摩擦焊接接头微观组织及性能影响

通过对原始搅拌摩擦焊（FSW）接头中间位置进行缺口挖补以模拟焊缝缺陷,采用钨极氩弧焊（TIG）补焊对其进行焊缝缺陷修复试验,研究该补焊工艺对接头微观组织及力学性能的影响规律,为贮箱的FSW焊缝性能评价提供技术支撑和后续工程指导。结果表明,相较于FSW接头,补焊接头TIG焊缝区主要由较大的等轴树枝晶组成,且与FSW焊缝交界处相互掺杂着粗大等轴晶和细小等轴晶;补焊接头固溶区受热循环影响较大,晶粒较为粗大,而过时效区受热循环影响较小,会发生过时效化并形成软化区。补焊接头抗拉强度与延伸率相较于原始FSW接头有所降低,硬度分布大致呈“W”形,WNZ区为硬度值最低处;补焊接头断裂位置始于焊趾处,断口存在大量韧窝,同时韧窝内存在第二相粒子,呈现韧性断裂机制。     

C/C-ZrC复合材料的制备及结构性能研究

采用针刺及细编穿刺结构分别引入热解碳和沥青碳的多孔C/C坯体,通过反应熔渗工艺（RMI）与熔融金属Zr反应制备了C/C-ZrC复合材料。研究了预制体结构和基体碳类型对C/C-ZrC复合材料微观结构及力学性能的影响。结果表明：材料熔渗后只由C,ZrC两相组成,孔隙率5%~10%,ZrC质量分数53%~63%。针刺结构的C/C坯体熔渗效果更好,制得的C/C-ZrC复合材料密度最高达到3.21 g/cm³;ZrC质量分数达到62.8%。热解碳基体在熔渗过程中对纤维保护作用更好,C/C-ZrC复合材料的弯曲强度达到148 MPa,压缩强度达到408 MPa。     

Precipitation behavior and properties of extruded 7136 aluminum alloy under different aging treatments

In this work, the mechanical properties and electrical conductivity of the extruded 7136 aluminum alloy treated by single-stage aging treatment (T6), retrogression and re-aging treatment (RRA), and multiple retrogression and re-aging treatment have been investigated by means of hardness measurements, electrical conductivity tests and tensile tests. The results have shown that the properties of the 7136 alloy such as hardness, tensile strength and electrical conductivity were sensitive to retrogression time (within 90 min). With prolonging the retrogression time, the tensile strength was enhanced first and then decreased, yet the electrical conductivity was continuously increased. The 60 min-treated alloy performed the highest tensile strength (716 MPa), whereas the 90 min-treated alloy possessed the highest electrical conductivity (33.95%IACS). Compared with the T6-treated alloy, the tensile strength and electrical conductivity were improved by 3.3% and 18.9%, respectively. The electrical conductivity showed an obvious increase with repetitious times of the RRA treatment. After 3RRA60 treatment, a good combination of tensile strength (705 MPa) and electrical conductivity (33.20%IACS) can be obtained. Compared with the T6 condition, the tensile strength and electrical conductivity were improved by 1.7% and 16.3%, respectively. The mechanism of microstructure evolution under different aging treatments has been discussed in detail.