Microstructure and Hot Deformation Behavior of Mg-9Al-3Si-0.375Sr-0.78Y Alloy

Using Gleeble-3500 thermal simulator， the high temperature plastic deformation behavior and microstructure evolution of Mg-9Al-3Si-0.375Sr-0.78Y alloy are investigated at the temperature of 523 K?673 K and the strain rate of 10-3 s-1?10 s-1. True strain-true stress curves show the characteristics of the typical dynamically recrystallization process. The Arrhenius constitutive equation of the hyperbolic model is established. The average activation energy and the strain rate sensitivity index are， respectively， 221.578 kJ.mol-1 and 0.137. The result shows that the α-Mg phase exhibits dynamic recrystallization (DRX) characteristics obviously. But no DRX occurs in theβ-Mg17Al12 phase. Hot deformation does not affect the primary Mg2Si phase. Under the conditions of low temperature (523 K?673 K) and high strain rate (1 s-1?10 s-1)， the flow instability and macro-defects such as crack appear in the specimens. However， there are finer recrystallization grains. Under the conditions of high temperature (≥673 K) or low strain rate， the microstructure of the alloy shows good homogeneity. The size of the primary Mg2Si phase is uniform， the size of the β-Mg17Al12 phase is small， and the distribution of the β-Mg17Al12 phase is uniform.     

预浸带缠绕过程缠绕层温度场变化研究

为了研究工艺参数对复合材料缠绕层的温度分布的影响，采用经典热力学理论针对预浸带缠绕过程中的传热机制进行分析；基于缠绕过程中的周期性变化规律，同时以变化的旧层初始温度为传热模型的初始边界条件，构建预浸带缠绕温度分布模型，并通过Matlab编程获得一维热传递模型的精确数值解。理论分析了缠绕初始温度、缠绕速度及芯模温度对缠绕层温度变化的影响。结果表明，对缠绕层温度影响程度依次为芯模温度＞缠绕速度＞缠绕初始温度；而且无论影响参数如何变化，缠绕层的温度分布始终为内层温度较低，并随着径向位置增大，缠绕层温度也在逐渐升高，直到外层最高温度。此外，通过实验对比分析，说明该温度分布模型满足工程要求，可为缠绕工艺研究提供指导。